An acoustic set up for the vibration analysis of silicon wafers

Author(s)
S. Mitterhofer, J. D. Puehringer, V. Schlosser
Abstract

Two simple experimental set-ups for acoustic mode analysis of silicon wafers were established. Audible vibratory mode data of single- and multi-crystalline silicon wafers with different thicknesses were investigated. Natural frequency data were found to correlate linearly with the wafer thickness. The observed dependence is theoretically explained by the Kirchhoff plate model. Deviations from the linear variation are attributed to inhomogeneities and mechanical damage of the wafer. Mechanical defects are the reason for an increased fracture probability.

Organisation(s)
Electronic Properties of Materials
Pages
8068-8073
No. of pages
6
DOI
https://doi.org/10.1109/IECON.2013.6700482
Publication date
2013
Publication status
Published
Austrian Fields of Science 2012
103002 Acoustics, 103018 Materials physics
Keywords
silicon wafer, vibrations, diagnostics, CRACK DETECTION
Portal url
https://ucris.univie.ac.at/portal/en/publications/an-acoustic-set-up-for-the-vibration-analysis-of-silicon-wafers(4fdd0ee2-eac7-4a8b-b9d9-cd97e208db32).html